Bosch Launches New Application Board 3.0 for Sensortec "Shuttle Board" Sensor Module Evaluation
Accepting a single sensor board at a time, this compact development board aims to speed evaluation of Sensortec hardware.
Bosch's sensor division has announced the launch of a new development board, the pleasingly simply-named Application Board 3.0, for its Sensortec range of sensors — using a socket and breakout boards to speed testing and remove wiring.
"The newly launched Application Board 3.0 provides a versatile development solution that makes it quick and easy for engineers to work with all Bosch Sensortec sensors on one common platform," the company claims of its latest creation. "The new board simplifies the evaluation and prototyping of sensors for a wide range of applications, particularly in Industry 4.0, IoT, Smart Home systems, and wrist- and head-mounted wearables."
Designed to accept Sensortec sensors on pre-built breakout modules, dubbed Shuttle Boards, the Application Board 3.0 has a single socket for a sensor. Once the sensor is added, an on-board Nordic nRF52840-based u-blox NINA-B302 microcontroller with 256kB RAM and 1MB of internal flash is programmed using Bosch's own integrated development environment — and there's 256MB of external flash for data logging.
The compact development board includes USB and Bluetooth 5.0 Low Energy (BLE) connectivity with an integrated antenna, and includes a temperature sensor, debug header, and a connector for an optional lithium-ion or lithium-polymer battery for testing devices out untethered.
So far, Bosch has confirmed a range of Shuttle Board sensor modules including accelerometers, magnetometers, inertial measurement units (IMUs), absolute orientation sensors, pressure sensors, humidity sensors, gas sensors, and its BHI260AP "Smart Sensor" with environmental, pressure, and magnetometer sensors on-board. More modules are expected to follow.
Pricing for the board has yet to be confirmed, but more details are available on the Bosch Sensortec website.