Tria Technologies Shows Off AI-Focused Qualcomm-Powered Compute Modules at Embedded World

Up to 100 TOPS on offer from the company's Dragonwing- and Snapdragon X Elite-powered embedded compute hardware.

Avnet's embedded computing specialist subsidiary Tria Technologies has launched five new product families at Embedded World — all powered by Qualcomm's Dragonwing or Snapdragon X Elite chips and targeting low-power high-performance edge computing and on-device machine learning and artificial intelligence (ML and AI) workloads.

"We are very excited about our relationship with Qualcomm Technologies and showcasing our new modules, which are applicable to a wide range of low- to high-end applications," says Tria Technologies' Daniel Denzler. "This new module family based on Dragonwing platforms enables us to address virtually any requirement, conserving power, upgrading performance, and delivering AI capabilities for use in challenging environments, across a range of module standards."

Tria Technologies is launching no fewer than five compute modules at Embedded World this week, including some COM-HPC parts. (📷: Tria Technologies)

The first four products being showcased by Tria Technologies at Embedded World this week are: the Tria IQ-9075 Vision AI-KIT, featuring Qualcomm's Dragonwing IQ-9075 processor with eight-core Kyro Gen 6 processor, Adreno 663 graphics processor, and a neural processor delivering 100 tera-operations per second (TOPS) of dense INT8 compute; the Tria SMARC QCS6490, with a Dragonwing QCS6490 system-on-chip with eight-core Kryo 670 CPU, Adreno 643L GPU, Hexagon 770 accelerator, and a 12 TOPS sensing hub; the Tria SMARC QCS5430 with Dragonwing QCS5430, a six-core Kryo 670 part with Adreno 642L GPU, Hexagon 770 accelerator, and a dual-core AI processor delivering 3.5 TOPS; the Tria IQ-615 in OSM and SMARC formats with eight-core Kryo 470 CPU, Adreno 612 GPU, and an unspecified model of Hexagon accelerator.

The final product Tria Technologies is showing off is a Snapdragon X Elite module, available in COM Express and COM-HPC formats and using Qualcomm's range-topping system-on-chip designed for laptops and on-device artificial intelligence. The top-end chip in Qualcomm's range has 12 Oryon CPU cores running at up to 3.8GHz all-core and 4.2GHz for two cores, an Adreno graphics processor delivering up to 4.6 tera-floating points operations per second (TFLOPS), a Hexagon accelerator delivering a further 45 TOPS, and support for up to 64GB of LPDDR5x memory.

Interested parties can learn more on the Tria Technologies website, or visit the company at Embedded World in Nuremberg this week at Hall 3A Booth 225.

ghalfacree

Freelance journalist, technical author, hacker, tinkerer, erstwhile sysadmin. For hire: freelance@halfacree.co.uk.

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